1.

Conference Proceedings
Conference Proceedings
1. Particle-free semiconductor cutting using the water jet guided laser
Perrottet, D. ; Spiegel, A. ; Wagner, F. ; Housh, R. ; Richerzhagen, B. ; Manley, J.
Pub. info.: Photon Processing in Microelectronics and Photonics IV.  pp.240-246,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5713
2.

Conference Proceedings
Conference Proceedings
2. Heat damage-free laser-microjet cutting achieves highest die fracture strength
Perrottet, D. ; Housh, R. ; Richerzhagen, B. ; Manley, J.
Pub. info.: Photon Processing in Microelectronics and Photonics IV.  pp.285-292,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5713
3.

Technical Paper
Technical Paper
3. Water Jet Guided Laser Cutting: a Powerful Hybrid Technology for Fine Cutting and Grooving.
Richerzhagen, B. ; Housh, R. ; Wagner, F. ; Manley, J.
Pub. info.: SME technical paper.  2005.  Society of Manufacturing Engineers