Fusalba, F. ; Cornec, C.Le ; Maury, P. ; Remiat, B. ; Jousseaume, V. ; Haxaire, K. ; Mourier, T. ; Haumesser, P.H ; Maitrejean, S. ; Simon, J. ; Chabli, A. ; Passemard, G. ; Fusalba, F. ; Cornec, C.Le ; Maury, P. ; Remiat, B. ; Jousseaume, V.
Pub. info.:
Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. pp.186-205, 2003. Pennington, N.J.. Electrochemical Society
Maitrejean, S. ; Allegret, S. ; Fillot, F. ; Farjot, T. ; Guillaumot, B. ; Passemard, G.
Pub. info.:
Fundamentals of novel oxide/semiconductor interfaces : symposium held December 1-4, 2003, Boston, Massachusetts, U.S.A.. pp.285-290, 2004. Warrendale, Pa.. Materials Research Society
Fillot, F. ; Maitrejean, S. ; Farjot, T. ; Guillaumot, B. ; Chenevier, B. ; Passemard, G.
Pub. info.:
Fundamentals of novel oxide/semiconductor interfaces : symposium held December 1-4, 2003, Boston, Massachusetts, U.S.A.. pp.259-266, 2004. Warrendale, Pa.. Materials Research Society
Verdier, M. ; Montagnat, M. ; Maitrejean, S. ; Passemard, O.
Pub. info.:
Thin films : stresses and mechanical properties X : symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.. pp.263-268, 2002. Warrendale, Pa.. Materials Research Society
Ciaramella, F. ; Jousseaume, V. ; Maitrejean, S. ; Remiat, B. ; Verdier, M. ; Passemard, G.
Pub. info.:
Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A.. pp.17-22, 2005. Warrendale, Pa.. Materials Research Society