1.

Conference Proceedings
Conference Proceedings
1. Comparison of the Release at a Hydrophobic and a Hydrophilic Direct Bonding Interface
Mack, S. ; Baumann, H. ; Werner, H. ; Schloegl, R.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.299-306,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. What Determines the Bonding Speed in Silicon Wafer Bonding
Martini, T. ; Schmidt, E. ; Mack, S. ; Stenzel, H. ; Li, S. ; Goesele, U.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.147-154,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7
3.

Conference Proceedings
Conference Proceedings
3. Bonding of Structured Wafers
Baumann, H. ; Mack, S. ; Muenzel, H.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.471-487,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7
4.

Technical Paper
Technical Paper
4. The Ground Simulation Upgrade of the Large Wind Tunnel at the Technische Universitat Munchen.
Mack, S. ; Indinger, T.
Pub. info.: 2012 SAE world congress : technical paper.  2012.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2012
5.

Conference Proceedings
Conference Proceedings
5. C60 nanoparticle quenching used as a biological label
Feng, J. ; Mack, S. ; Shan, G. ; Gee, S. ; Hammock, B.D. ; Kennedy, I.M.
Pub. info.: Genetically Engineered and Optical Probes for Biomedical Applications.  pp.156-163,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4967