1.

Conference Proceedings
Conference Proceedings
1. Design-to-process integration: optimizing 130-nm X architecture manufacturing
Dean, R. ; Malhotra, V.K. ; King, N. ; Sanie, M. ; MacDonald, S.S. ; Jordan, J.D. ; Hirukawa, S.
Pub. info.: Design and process integration for microelectronic manufacturing II : 26-28 February 2003, Santa Clara, California, USA.  pp.197-204,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5042
2.

Conference Proceedings
Conference Proceedings
2. The study of phase angle effects to wafer process window using 193-nm EAPSM in a 300-mm wafer manufacturing environment
Chou, W.Y. ; Yen, S.M. ; Wu, J.K. ; Shieh, W.B. ; Chuang, M. ; Fan, G. ; Tseng, C.C. ; Hughes, G.P. ; MacDonald, S.S. ; Holiday, C. ; Chen, G.
Pub. info.: Photomask and Next-Generation Lithography Mask Technology XI.  pp.615-623,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5446