1.

Conference Proceedings
Conference Proceedings
1. Etching Rate Enhancement of Copper by Adding Sulfur Compounds in Chemical-Mechanical Polishing Slurries
T. Kanki ; T. Shirasu ; T. Kimura ; T. Nakamura ; M. Miyajima
Pub. info.: Electrochemical Processing in ULSI and MEMS 3.  pp.65-75,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 6(8)
2.

Conference Proceedings
Conference Proceedings
2. Extension of Stacking Faults in 4H-SiC pn Diodes under a High Current Pulse Stress
Y. Iwahashi ; M. Miyazato ; M. Miyajima ; Y. Yonezawa ; T. Kato ; H. Fujiwara ; K. Hamada ; A. Otsuki ; H. Okumura
Pub. info.: Silicon Carbide and Related Materials 2016.  pp.218-221,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 897
3.

Conference Proceedings
Conference Proceedings
3. Suppression of the Forward Degradation in 4H-SiC PiN Diodes by Employing a Recombination-Enhanced Buffer Layer
T. Tawara ; T. Miyazawa ; M. Ryo ; M. Miyazato ; T. Fujimoto ; K. Takenaka ; S. Matsunaga ; M. Miyajima ; A. Otsuki ; Y. Yonezawa ; T. Kato ; H. Okumura ; T. Kimoto ; H. Tsuchida
Pub. info.: Silicon Carbide and Related Materials 2016.  pp.419-422,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 897
4.

Conference Proceedings
Conference Proceedings
4. Applying photolithography-friendly design to e-beam direct writing in 65-nm node and beyond
H. Hoshino ; K. Ogino ; Y. Machida ; M. Miyajima ; T. Maruyama
Pub. info.: Emerging lithographic technologies XII.  2  pp.69212K-1-69212K-12,  2008.  Bellingham, Wash..  Society of Photo-optical Instrumentation Engineers
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6921