1.

Conference Proceedings
Conference Proceedings
1. Elimination of Post Cu-CMP Watermark by Optimizing Post CMP Clean to Control Cu Dissolution
S. Petitdidier ; M. Mellier ; C. Trouiller ; C. Euvrard ; M. Juhel
Pub. info.: Cleaning and surface conditioning technology in semiconductor device manufacturing 10.  pp.387-394,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 11(2)
2.

Conference Proceedings
Conference Proceedings
2. Post Cu-CMP Engineering Challenges for the 65 nm Technology Nodes and Beyond
S. Petitdidier ; M. Mellier ; D. Guiheux ; M. Juhel
Pub. info.: Cleaning and surface conditioning technology in semiconductor device manufacturing 10.  pp.431-440,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 11(2)