1.

Conference Proceedings
Conference Proceedings
1. Challenges in FEOL Logic Device Integration for 32 nm Technology Node and Beyond
D. Park ; M. Chudzik ; H. Yin
Pub. info.: ULSI process integration 5.  pp.371-377,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 11(6)
2.

Conference Proceedings
Conference Proceedings
2. Surface Treatment and Functionalization Effects on Chemical Vapor Deposition and Atomic Layer Deposition Grown HfO2
S. Consiglio ; R. Mo ; T. Tai ; S. Krishnan ; D. O'Meara ; C. Wajda ; M. Chudzik
Pub. info.: Advanced gate stack, source/drain and channel engineering for Si-based CMOS 3 : new materials, processes and equipment.  pp.167-178,  2007.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 6(1)
3.

Conference Proceedings
Conference Proceedings
3. Charge Defects, Vt Shifts, and the Solution to the High-K Metal Gate n-MOSFET Problem
S. Guha ; V. Narayanan ; V. Paruchuri ; B. Linder ; M. Copel ; N. Bojarczuk ; Y. Kim ; M. Chudzik ; Y. Wang ; P. Ronsheim
Pub. info.: Advanced gate stack, source/drain and channel engineering for Si-based CMOS 2: new materials, processes, and equipment.  pp.247-252,  2006.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(2)