1.

Conference Proceedings

Conference Proceedings
P.T. Baine ; M. Bain ; D.W. McNeill ; H.S. Gamble ; M. Armstrong
Pub. info.: Semiconductor wafer bonding 9 : science, technology, and applications.  pp.165-173,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(6)
2.

Technical Paper

Technical Paper
M. Armstrong ; C. De Tenorio ; E. Garcia ; D. Mavris
Pub. info.: AIAA meeting papers on disc.  2008.  Reston, Va..  American Institute of Aeronautics and Astronautics
Title of ser.: AIAA Paper : AIAA Aviation Technology, Integration and Operations Conference (ATIO)
Ser. no.: 2008
3.

Technical Paper

Technical Paper
D. Mavris ; C. de Tenorio ; M. Armstrong
Pub. info.: AIAA meeting papers on disc.  2008.  Reston, Va..  American Institute of Aeronautics and Astronautics
Title of ser.: AIAA Paper : Aerospace Sciences Meeting and Exhibit
Ser. no.: 2008