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15 results

Conference Proceedings

1. Novel Alignment Technologies for Wafer Level Packaging

Brubaker, C. ; Glinsner, T. ; Lindner, P. ; Schaefer, C. ; Tischler, M.

Pub. info.:	Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001. pp.594-599, 2001. Washington, DC. IMAPS
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4587

Conference Proceedings

2. *BUTTERFLY PATTERNS: AN ANOMALY COMMON TO THE NEUTRON SCATTERING SPECTRA OF ELONGATED RUBBERS, MELTS AND GELS

Bastide, J. ; Boue, F. ; Oeser, R. ; Mendes, E. ; Zielinski, F. ; Buzier, M. ; Lartigue, C. ; Lindner, P.

Pub. info.:	Complex fluids : symposium held December 2-6, 1991, Boston, Massachusetts, U.S.A.. pp.313-324, 1992. Pittsburgh. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	248

Conference Proceedings

3. Plasma activated water bonding for MEMS

Dragoi, V. ; Farrens, S. ; Lindner, P.

Pub. info.:	Smart sensors, actuators, and MEMS II : 9-11 May 2005, Seville, Spain. pp.179-187, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5836

Conference Proceedings

4. Beginning-to-end wafer bonding for advanced optical systems (Invited Paper)

Farrens, S.N. ; Lindner, P. ; Dwyer, S. ; Wimplinger, M.

Pub. info.:	Gradient index, miniature, and diffractive optical systems III : 6-7 August 2003, San Diego, California, USA. pp.31-36, 2003. Bellingham, Wash., USA. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5177

Conference Proceedings

5. Advanced Anodic Bonding Processes for MEMS Applications

Dragoi, V. ; Lindner, P. ; Glinsner, T. ; Wimplinger, M. ; Farrens, S.

Pub. info.:	Micro- and nanosystems : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A.. pp.337-342, 2004. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	782

Conference Proceedings

6. Solar blind and bispectral imaging with ICCD, BCCD, and EBCCD cameras

Lindner, M. B. ; Elstein, S. ; Lindner, P.

Pub. info.:	Image intensifiers and applications : and characteristics and consequences of space debris and near-earth objects, 23 July 1998, San Diego, California. pp.22-33, 1998. Bellingham, Wash., USA. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	3434

Conference Proceedings

7. Plasma Bonding Replacement Methods for Traditional Bond Technologies

Farrens, S. ; Dragoi, V. ; Pelzer, R. ; Wimplinger, M. ; Lindner, P.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.58-63, 2005. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2005-02

Conference Proceedings

8. Triple-Stack Anodic Bonding for MEMS Applications

Dragoi, V. ; Glinsner, T. ; Hangweier, P. ; Lindner, P.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.329-336, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

9. One Micron Wafer to Wafer Alignment for 3D Interconnecting Device Integration

Brubaker, C. ; Glinaner, T. ; Lindner, P. ; Schaefer, C. ; Tiachler, M.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.155-162, 2001. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2001-27

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Conference Proceedings

10. Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding.

Niklaus, F. ; Kumar, R.J. ; McMahon, J.J. ; Yu, J. ; Matthias, T. ; Wimplinger, M. ; Lindner, P. ; Lu, J.-Q. ; Cale, T.S. ; Gutmann, R.J.

Pub. info.:	Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A.. pp.393-398, 2005. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	863

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