1.

Conference Proceedings
Conference Proceedings
1. Defect reduction through characterization and equipment modification in tungsten residue caused by deposition process
Lin,H.-T. ; Lee,S.-C. ; Chang,H.-W.
Pub. info.: Process, Equipment, and Materials Control in Integrated Circuit Manufacturing II.  pp.107-114,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2876
2.

Conference Proceedings
Conference Proceedings
2. Trench pattern lithography for 0.13- and 0.10-μm logic devices at 248- and 193-nm wavelengths
Wang,Y.-Y. ; Lin,H.-T. ; Yu,S.-S. ; Chen,C.-K. ; Ku,Y.-C. ; Yen,A. ; Lin,B.J.
Pub. info.: Optical Microlithography XIV.  4346  pp.276-292,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4346