1.

Conference Proceedings
Conference Proceedings
1. Nanostructured Ta-Si-N Thin Films as Diffusion Barriers between Cu and SiO2
Lai, L.W. ; Chang, C.C. ; Chen, J.S. ; Lin, Y.K.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.154-163,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Technical Paper
Technical Paper
2. Determination of Flow Stresses of Aluminum Tubes by Hydraulic Bulge Tests.
Hwang, Y.M. ; Lin, Y.K. ; Altan, T.
Pub. info.: S.M.E. technical paper.  2006.  Dearborn, Mich..  Society of Manufacturing Engineers
Title of ser.: SME Technical Paper : TP
Ser. no.: 2006
3.

Technical Paper
Technical Paper
3. Analytical Procedures for Estimasting Structural Response to Acoustic Fields Generated by Advanced Launch Systems
Elishakoff, I. ; Lin, Y.K. ; Zhu, L.P. ; Fang, J.J. ; Cai, G.Q.
Pub. info.: NASA Technical Reports.  (NASA-CR-195447),  pp.1-272,  1994.  National Aeronautics and Space Adminstration