1.

Conference Proceedings
Conference Proceedings
1. STRESS INDUCED VOID NUCLEATION IN NARROW ALUMINUM ALLOY LINES
Borgesen, P. ; Korkohen, M. A. ; Basa, C. ; LaFontaine, W. R. ; Land, B. ; Li, C. -Y.
Pub. info.: Mechanical behavior of materials and structures in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A..  pp.401-406,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 226
2.

Conference Proceedings
Conference Proceedings
2. STRESS INDUCED VOID NUCLEATION IN NARROW ALUMINUM ALLOY LINES
Borgesen, P. ; Korhonen, M. A. ; Basa, C. ; LaFontaine, W. R. ; Land, B. ; Li, C. -Y.
Pub. info.: Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A..  pp.143-148,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 225
3.

Conference Proceedings
Conference Proceedings
3. MATERIAL AND RELIABILITY CONSIDERATIONS FOR ANISOTROPICALLY CONDUCTIVE ADHESIVE BASED INTERCONNECTS
Dion, J. ; Borgesen, P. ; Yost, B. ; Lilienfeld, D. A. ; Li, C. -Y.
Pub. info.: Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A..  pp.27-,  1994.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 323
4.

Conference Proceedings
Conference Proceedings
4. MECHANICAL PROPERTIES OF PLATED COPPER
Korhonen, M. A. ; Brown, D. D. ; Li, C. -Y. ; Steinwall, J. E.
Pub. info.: Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A..  pp.103-,  1994.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 323
5.

Conference Proceedings
Conference Proceedings
5. ANALYSIS OF THERMAL STRESS INDUCED VOID GROWTH DURING THERMAL CYCLING
Brown, D. D. ; Korhonen, M. A. ; Borgesen, P. ; Li, C. -Y.
Pub. info.: Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A..  pp.223-,  1993.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 309
6.

Conference Proceedings
Conference Proceedings
6. MICROSTRUCTURE BASED MODELLING OF STRESS MIGRATION AND ELECTROMIGRATION INDUCED FAILURE DISTRIBUTIONS
Borgesen, P. ; Korhonen, M. A. ; Brown, D. D. ; Li, C. -Y.
Pub. info.: Thin films : stresses and mechanical properties IV : symposium held April 12-16, 1993, San Francisco, California, U.S.A..  pp.255-,  1993.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 308
7.

Conference Proceedings
Conference Proceedings
7. ELECTROMIGRATION DAMAGE BY CURRENT INDUCED COALESCENCE OF THERMAL STRESS VOIDS
Borgesen, P. ; Korhonen, M. A. ; Sullivan, T. D. ; Brown, D. D. ; Li, C. -Y.
Pub. info.: Thin films : stresses and mechanical properties III : symposium held December 2-5, 1991, Boston, Massachusetts, U.S.A..  pp.683-688,  1992.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 239
8.

Conference Proceedings
Conference Proceedings
8. THERMAL STRESS INDUCED VOID FORMATION IN NARROW PASSIVATED Cu LINES
Brown, D. D. ; Borgesen, P. ; Lilienfeld, D. A. ; Korhonen, M. A. ; Li, C. -Y.
Pub. info.: Thin films : stresses and mechanical properties III : symposium held December 2-5, 1991, Boston, Massachusetts, U.S.A..  pp.701-706,  1992.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 239
9.

Conference Proceedings
Conference Proceedings
9. THE EFFECT OF LINE GEOMETRY ON VOID GROWTH IN THIN, NARROW ALUMINUM LINES
Borgesen, P. ; Lee, J. K. ; Korhonen, M. A. ; Li, C. -Y.
Pub. info.: Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A..  pp.149-154,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 225
10.

Conference Proceedings
Conference Proceedings
10. ANALYSIS OF THERMAL STRESS INDUCED VOID GROWTH DURING THERMAL CYCLING
Brown, D. D. ; Korhonen, M. A. ; Borgesen, P. ; Li, C. -Y.
Pub. info.: Thin films : stresses and mechanical properties IV : symposium held April 12-16, 1993, San Francisco, California, U.S.A..  pp.291-,  1993.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 308