1.

Conference Proceedings
Conference Proceedings
1. INTERACTIONS OF COPPER WITH INTERLAYER DIELECTRICS AND ADHESION PROMOTERS/DIFFUSION BARRIERS
Arcot, B.. ; Shy, Y.T. ; Murarka, S.P. ; Shepard, C. ; Lanford, W.A.
Pub. info.: Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A..  pp.27-32,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 203
2.

Conference Proceedings
Conference Proceedings
2. HOMOEPITAXY DIAMOND GROWN ON MEV ION IMPLANTED 192 DIAMOND
Woo, J.T. ; Wei, J. ; Tzeng, Y. ; Lanford, W.A.
Pub. info.: Proceedings of the Third International Symposium on Diamond Materials.  pp.192-197,  1993.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-17