1.

Conference Proceedings
Conference Proceedings
1. Development of Electrochemical Mechanical Polishing for Advanced Copper Planarization
R. Jia ; Y. Wang ; Z. Wang ; S. Tsai ; J. Dma ; D. Mao ; L. Karuppiah ; L. Chen
Pub. info.: Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA.  pp.125-134,  2006.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 1(11)
2.

Conference Proceedings
Conference Proceedings
2. Aluminum Alloy Formation and Impacts in Advanced Replacement Metal Gate Process
K. Xu ; Y. Wang ; S.H. Shen ; X. Xia ; W.Ch. Tu ; L. Karuppiah ; H. Yang ; Z. Ge ; Y. Lei ; M. Allen ; N. Yoshida ; L.W. Chang ; B. Liu ; M. Okazaki ; A. Brand
Pub. info.: Structural and chemical characterization of metals, alloys and compounds, 2011 : symposium held August 14-19, 2011, Cancún, Mexico.  pp.107-116,  2012.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 1372