1.

Conference Proceedings
Conference Proceedings
1. Electrochemical Behavior of Copper in Post-Via-Etch Cleaning Solutions
S. Bilouk ; C. Pernel ; R.P. Nogueira ; L. Broussous ; P. Haumesser
Pub. info.: Cleaning and surface conditioning technology in semiconductor device manufacturing 10.  pp.395-402,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 11(2)
2.

Conference Proceedings
Conference Proceedings
2. STUDY OF THE KINETICS OF THE COPPER CLEANING BY X-RAY REFLECTOMETRY
D. Rébiscoul ; L. Broussous ; D. Louis ; G. Passemard
Pub. info.: Cleaning Technology in Semiconductor Device Manufacturing IX.  pp.365-372,  2006.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 1(3)