1.

Conference Proceedings
Conference Proceedings
1. Tribological, Thermal and Kinetic Attributes of Copper and Silicon Dioxide CMP Processes
Y. Zhuang ; Z. Li ; J. Sorooshian ; A. Philipossian ; L. Borucki
Pub. info.: Electrodeposition Processes in Semiconductor Device Fabrication.  pp.91c-,  2004.  New York.  American Institute of Chemical Engineers
Title of ser.: AIChE Conference Proceedings
Ser. no.: P-213(T8)
2.

Conference Proceedings
Conference Proceedings
2. Tribological, Thermal and Kinetic Attributes of Copper and Silicon Dioxide CMP Processes
Y. Zhuang ; Z. Li ; J. Sorooshian ; A. Philipossian ; L. Borucki
Pub. info.: 2004 AIChE annual meeting, Austin Covention Center, Austin, Texas, November 7-12 : conference proceedings.  pp.91c-,  2004.  New York.  American Institute of Chemical Engineers
Title of ser.: AIChE Conference Proceedings
Ser. no.: P-213
3.

Conference Proceedings
Conference Proceedings
3. Study of Inhibition Characteristics of Slurry Additives in Copper CMP Using Force Spectroscopy
M. K. Keswani ; H. Lee ; S. Babu ; U. Patri ; Y. Hong ; L. Economikos ; M. Goldstein ; L. Borucki ; A. Philipossian ; Y. Zhuang
Pub. info.: Silicon materials science and technology X.  pp.515-522,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 2(2)