1.

Conference Proceedings
Conference Proceedings
1. Integration of CMP Fixed Abrasive Polishing into the Manufacturing of Thick Film SOI Substrates
Kulawski, Martin ; Luoto, Hannu ; Henttinen, Kimmo ; Suni, Tommi ; Weimar, Frauke ; Makinen, Jari
Pub. info.: Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A..  pp.111-116,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 867
2.

Conference Proceedings
Conference Proceedings
2. A Novel CMP Process on Fixed Abrasive Pads for the Manufacturing of Highly Planar Thick Film SOI Substrates
Kulawski, Martin ; Henttinen, Kimmo ; Suni, Ilkka ; Weimar, Frauke ; Makinen, Jari
Pub. info.: Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A..  pp.133-140,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 767
3.

Conference Proceedings
Conference Proceedings
3. Advances in the CMP Process on Fixed Abrasive Pads for the Polishing of SOI-Substrates With High Degree of Flatness
Kulawski, Martin ; Luoto, Hannu ; Henttinen, Kimmo ; Suni, Ilkka ; Weimar, Franke ; Makinen, Jari
Pub. info.: Advances in chemical-mechanical polishing : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.191-196,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 816