1.

Conference Proceedings
Conference Proceedings
1. Chemical-mechanical Planarization of Copper: Role of Oxidants and Inhibitors
Kuiry, S. ; Deshpande, S. ; Obeng, Y. ; Seal, S.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.52-60,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21
2.

Conference Proceedings
Conference Proceedings
2. Role of Hydrogen Peroxide and Glycine on Ta-CMP
Kuiry, S. ; Seal, S. ; Megen, E. ; Ramsdell, J. ; Wannaparhun, S.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.139-147,  2002.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-1