1.

Conference Proceedings
Conference Proceedings
1. A CORRELATION BETWEEN Si SURFACE MICRO-ROUGHNESS AND ATOMIC CONCENTRATION ON SURFACE: APPLICATION TO MICRO-ROUGHNESS MEASUREMENT OF Si
Oki, I. ; Biwa, T. ; Kudo, J. ; Shibayama, H.
Pub. info.: Chemical surface preparation, passivation, and cleaning for semiconductor growth and processing : symposium held April 27-29, 1992, San Francisco, California, U.S.A..  pp.143-148,  1992.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 259
2.

Conference Proceedings
Conference Proceedings
2. EVALUATION ON ELECTROMIGRATION AND STRESSMIGRATION OF METAL INTERCONNECTIONS BY HARDNESS MEASUREMENTS
Nakagawa, T. ; Miyatake, H. ; Maeda, T. ; Kuroda, K. ; Tokushige, N. ; Inoue, R. ; Kudo, J. ; Ashida, T.
Pub. info.: Mechanical behavior of materials and structures in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A..  pp.425-432,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 226
3.

Conference Proceedings
Conference Proceedings
3. EPITAXIAL GROWTH OF InP ON Si BY MOCVD
Konushi, F. ; Seki, A. ; Kudo, J. ; Sato, H. ; Kakimoto, S. ; Fukushima, T. ; Kubota, Y. ; Koba, M.
Pub. info.: Heteroepitaxy on silicon : fundamentals, structure, and devices : symposium held April 5-8, 1988, Reno, Nevada, U.S.A..  pp.307-312,  1988.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 116
4.

Conference Proceedings
Conference Proceedings
4. A High Stability Electrode Technology for Stacked SrBi2Ta2O9 Capacitors
Kudo, J. ; Nagata, M. ; Ogata, N. ; Yamazaki, S. ; Urashima, H. ; Okutoh, A. ; Miyoshi, T. ; Ishihara, K.
Pub. info.: Ferroelectric thin films VII : symposium held November 30-December 3, 1998, Boston, Massachusetts, U.S.A..  pp.61-,  1999.  Warrendale, PA.  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 541
5.

Conference Proceedings
Conference Proceedings
5. EVALUATION ON ELECTROMIGRATION AND STRESSMIGRATION OF METAL INTERCONNECTIONS BY HARDNESS MEASUREMENTS
Nakagawa, T. ; Miyatake, H. ; Maeda, T. ; Kuroda, K. ; Tokushige, N. ; Inoue, R. ; Kudo, J. ; Ashida, T.
Pub. info.: Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A..  pp.167-176,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 225