1.

Conference Proceedings
Conference Proceedings
1. Flip-Chip Metallurgies for Lead-Free Solders
Korhonen, T. M. ; Hong, S. J. ; Korhonen, M. A. ; Li, C.-Y.
Pub. info.: Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A..  pp.79-,  1998.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 515
2.

Conference Proceedings
Conference Proceedings
2. Under Bump Metallization Development for Eutectic Pb-Sn Solders
Hong, S. J. ; Korhonen, T. M. ; Korhonen, M. A. ; Li, C.-Y.
Pub. info.: Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A..  pp.73-,  1998.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 515
3.

Conference Proceedings
Conference Proceedings
3. Low Stress Under Bump Metallizations for Direct Chip Attach
Su, P. ; Korhonen, T. M. ; Hong, S. J. ; Korhonen, M. A. ; Li, C. Y.
Pub. info.: Properties and processing of vapor-deposited coatings : symposium held November 30-December 2, 1998, Boston, Massachusetts, U.S.A..  pp.27-,  1999.  Warrendale, PA..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 555
4.

Conference Proceedings
Conference Proceedings
4. Under Bump Metallization Development for High Sn Solders
Korhonen, T. M. ; Hong, S. J. ; Su, P. ; Zhou, C. ; Korhonen, M. A. ; Li, C-Y.
Pub. info.: Thin-films : stresses and mechanical properties VII : symposium held December 1-5, 1997, Boston, Massachusetts, U.S.A..  pp.143-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 505