1.

Conference Proceedings
Conference Proceedings
1. Adhesion and Cu Diffusion Barrier Properties of a MnOx Barrier Layer Formed with Thermal MOCVD
Koji Neishi ; Vijay Kumar Dixit ; S. Aki ; Junichi Koike ; K. Matsumoto ; H. Sato ; H. Itoh ; S. Hosaka
Pub. info.: Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2009 : symposium held April 14-17, 2009, San Francisco, California, U.S.A..  pp.99-104,  2009.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 1156
2.

Conference Proceedings
Conference Proceedings
2. Electronic Transport Properties of Cu/MnOx/SiO₂/p-Si MOS Devices
Vijay Kumar Dixit ; Koji Neishi ; Junichi Koike
Pub. info.: Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2009 : symposium held April 14-17, 2009, San Francisco, California, U.S.A..  pp.105-112,  2009.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 1156