1.

Conference Proceedings
Conference Proceedings
1. Ohmic Contacts to Wide Gap Compound Semiconductor
Murakami, M. ; Koide, Y. ; Oku, T. ; Mori, H. ; Uchibori, C.J.
Pub. info.: Proceedings of the Twenty-Seventh State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XXVII).  pp.286-297,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-21
2.

Conference Proceedings
Conference Proceedings
2. CoAl Ohmic Contact Materials with Improved Surface Morphology for p-Type 4H-SiC
Nakatsuka, O. ; Koide, Y. ; Murakami, M.
Pub. info.: Silicon carbide and related materials 2001 : ICSCRM2001, proceedings of the International Conference on Silicon Carbide and Related Materials 2001, Tsukuba, Japan, October 28-November 2, 2001.  pp.885-888,  2002.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 389-393
3.

Conference Proceedings
Conference Proceedings
3. Preparation and Surface-Active Properties of Cotelomer Type Surfactants of Alkyl Acrylate and Acrylic Acid
Yoshimura, T. ; Koide, Y. ; Shosenji, H. ; Esumi, K.
Pub. info.: Proceedings of the International Conference on Colloid and Surface Science, Tokyo, Japan, November 5-8, 2000 : 25th Anniversary of the Division of Colloid and Surface Chemistry, the Chemical Society of Japan.  pp.145-148,  2001.  Amsterdam.  Elsevier
Title of ser.: Studies in surface science and catalysis
Ser. no.: 132
4.

Conference Proceedings
Conference Proceedings
4. Theoretical Analysis of Electron Statistics for n-Type Diamond
Koide, Y.
Pub. info.: PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, China.  pp.1719-1724,  2005.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 475-479(3)
5.

Conference Proceedings
Conference Proceedings
5. Development of Electrode Materials for Semiconductor Devices
Murakami, M. ; Koide, Y. ; Moriyama, M. ; Tsukimoto, S.
Pub. info.: PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, China.  pp.1705-1714,  2005.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 475-479(3)
6.

Conference Proceedings
Conference Proceedings
6. CoAl Ohmic Contact Materials with Improved Surface Morphology for p-Type 4H-SiC
Nakatsuka, O. ; Koide, Y. ; Murakami, M.
Pub. info.: Silicon carbide and related materials 2001 : ICSCRM2001, proceedings of the International Conference on Silicon Carbide and Related Materials 2001, Tsukuba, Japan, October 28-November 2, 2001.  pp.885-888,  2002.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 389-393
7.

Conference Proceedings
Conference Proceedings
7. Ohmic Contact Materials for Compound Semiconductors
Murakami, M. ; Oku, T. ; Koide, Y. ; Wakimoto, H. ; Furumai, M. ; Kobayashi, S.
Pub. info.: Proceedings of the Twenty-first State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XXI).  pp.163-174,  1994.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1994-34
8.

Technical Paper
Technical Paper
8. Studies on Cooling Air Ejected Over A Corrugated Wall: Its Aerodynamic Behavior and Film Effectiveness.
Funazaki, K. ; Igarashi, T. ; Koide, Y. ; Shinbo, K.
Pub. info.: A.S.M.E. paper.  2001.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : GT
Ser. no.: 2001
9.

Technical Paper
Technical Paper
9. Research of heat transfer of a liner for an afterburner
Shinbo, K. ; Koide, Y. ; Kashiwagi, T. ; Oguma, M. ; Mizuno, M. ; Funazaki, K. ; Igarashi, T.
Pub. info.: AIAA paper.  pp.1-10,  1997.  American Institute of Aeronautics and Astronautics
Title of ser.: AIAA Paper : AIAA/ASME/SAE/ASEE Joint Propulsion Conference and Exhibit
Ser. no.: 1997