1.

Conference Proceedings
Conference Proceedings
1. Effects of PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect
Kim,Y.T. ; Kim,D.J. ; Lee,S. ; Park,Y.K. ; Kim,I.-S. ; Park,J.-W.
Pub. info.: In-line characterization, yield reliability, and failure analysis in microelectronics manufacturing : 19-21 May 1999, Edinburgh, Scotland.  pp.227-233,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3743
2.

Conference Proceedings
Conference Proceedings
2. Formation and Annihilation of Epitaxial Stacking Faults Generated from Pre-Existing Nucleation Sites in Silicon
Cho,C.R. ; Noh,K.Y. ; Lee,D.H. ; Kim,Y.S. ; Ko,S.W. ; Kim,C.W. ; Kim,D.H. ; Son,C.B. ; Kim,S.J. ; Cho,D.H. ; Choi,J.J. ; Kim,D.J. ; Bae,K.M. ; Rozgonyi,G.A.
Pub. info.: High Purity Silicon VI : proceedings of the sixth International Symposium.  pp.201-208,  2000.  Pennington, N.J., Bellingham, Wash..  Electrochemical Society — SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4218
3.

Conference Proceedings
Conference Proceedings
3. Failure detection of reinforced concrete beams with embedded fiber optic Michelson sensors
Kwon,I.B. ; Park,P. ; Huh,Y.H. ; Kim,D.J. ; Hong,S.H. ; Lee,D.C. ; Titin,C. ; Moon,H.
Pub. info.: Smart structures and materials 2000 : smart systems for bridges, structures, and highways : 6-7 March 2000, Newport Beach, California.  pp.400-411,  2000.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3988
4.

Conference Proceedings
Conference Proceedings
4. Improvement in diffusion barrier properties of PECVD W-N thin film by low-energy BF2+ implantation
Kim,D.J. ; Kim,Y.T. ; Park,Y.K. ; Sim,H.S. ; Park,J.-W.
Pub. info.: In-line characterization, yield reliability, and failure analysis in microelectronics manufacturing : 19-21 May 1999, Edinburgh, Scotland.  pp.324-331,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3743
5.

Conference Proceedings
Conference Proceedings
5. Thermal stability of PECVD W-B-N thin film as a diffusion barrier
Kim,Y.T. ; Kim,D.J. ; Lee,C.W. ; Park,J.-W.
Pub. info.: Multilevel Interconnect Technology.  pp.48-56,  1997.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3214
6.

Conference Proceedings
Conference Proceedings
6. Digital video watermarking using 3D-DCT and intracubic correlation
Lim,J.H. ; Kim,D.J. ; Kim,H.T. ; Won,C.S.
Pub. info.: Security and Watermarking of Multimedia Contents III.  pp.64-72,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4314