1.

Conference Proceedings
Conference Proceedings
1. HYDROGENATION EFFECT OF AMORPHOUS SILICON THIN FILM TRANSISTORS BY ATMOSPHERIC PRESSURE CVD
Ahn, B.C. ; Kim, J.H. ; Kim, D.G. ; Moon, B.Y. ; Kim, K.N. ; Lee, C.W. ; Jang, J.
Pub. info.: Amorphous silicon technology, 1993 : Symposium held April 13-16, San Francisco, California, U.S.A..  pp.901-906,  1993.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 297
2.

Conference Proceedings
Conference Proceedings
2. EFFECT OF RF SPUTTERING ON T/H SUSCEPTIBILITY OF Cr/POLYIMIDE ADHESION
Kim, D.G. ; Oh, T.S. ; Molis, S. ; Kowalczyk, S. ; Kim, J.
Pub. info.: Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A..  pp.65-70,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 203
3.

Conference Proceedings
Conference Proceedings
3. *INFRARED CHARACTERIZATION OF RF SPUTTER ETCHING OF POLYIMIDE THIN FILMS
Molis, S.E. ; Kim, D.G. ; Kowalczyk, S.P. ; Kim, J.
Pub. info.: Electronic packaging materials science V : symposium held November 26-29, 1990, Boston, Massachusetts, U.S.A..  pp.53-58,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 203
4.

Conference Proceedings
Conference Proceedings
4. Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps
Kim, D.G. ; Ha, S.S. ; Jung, S.B.
Pub. info.: Eco-materials processing & design VII : proceedings of the Conference of the 7th International Symposium on Eco-materials Processing & Design, January 8-11 2006, Chengdu, China.  pp.550-553,  2006.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 510-511
5.

Conference Proceedings
Conference Proceedings
5. Effect of Heating Rate on Sintered Microstructure of W-Cu Nanocomposite Powder Produced Using W-CuO Mixture
Kim, D.G. ; Kim, G.S. ; Kim, J.C. ; Oh, S.T. ; Kim, Y.D.
Pub. info.: Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003.  pp.1125-1128,  2004.  Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 449-452
6.

Conference Proceedings
Conference Proceedings
6. Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application
Kim, D.G. ; Bae, J.S. ; Lee, J.H. ; Kim, Y.D. ; Ahn, Y.M.
Pub. info.: Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003.  pp.393-396,  2004.  Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 449-452
7.

Technical Paper
Technical Paper
7. Development of Hardware-in-the-Loop Simulator and Vehicle Dynamic Model for Testing ABS.
Lee, S.J. ; Kim, Y.J. ; Park, K. ; Kim, D.G.
Pub. info.: 2003 SAE world congress : technical paper.  2003.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2003