1.

Conference Proceedings
Conference Proceedings
1. Analysis of Nitride Bonding
Desmond, C.A. ; Olup, J.J. ; Abolghasem, P. ; Folta, J. ; Jernigan, G.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.171-178,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. The Formation of Abrupt N+ Doping Profiles Using Atomic Hydrogen and Sb During Si MBE
Thompson, P. E. ; Silvestre, C. ; Twigg, M. ; Jernigan, G. ; Simons, D. S.
Pub. info.: Epitaxy and applications of si-based heterostructures : symposium held April 13-17, 1998, San Francisco, California, U.S.A..  pp.367-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 533
3.

Conference Proceedings
Conference Proceedings
3. (10.4) 2:35 -2:55 PM - SiGe-based Combined MBE and CVD Processing for Vertical "Silicon-on-Nothing" (SON) Device Technology
Schulze, J. ; Eisele, I. ; Thompson, P.E. ; Jernigan, G. ; Bassim, N. ; Suligoj, T. (University of the German Federal Armed Forces Munich, US Naval Research Laboratory, University of Zagreb)
Pub. info.: SiGe: materials, processing, and devices : proceedings of the First international symposium.  pp.719-730,  2004.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-07