1.

Conference Proceedings
Conference Proceedings
1. Analysis of Solder Fatigue in Electronic Packaging Using a Mesh-Insensitive Structural Stress Method
J.K. Hong ; P.S. Dong
Pub. info.: Advanced welding and micro joining/packaging for the 21st century : selected peer reviewed papers from the International Welding/Joining Conference, Korea 2007 (IWJC, Korea 2007), which was held from 10th-12th May 2007 at COEX, Seoul, Korea.  pp.233-238,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 580-582
2.

Conference Proceedings
Conference Proceedings
2. FE Analysis of Microstructure Evolution during Ring Rolling Process of a Large-Scale Ti-6Al-4V Alloy Ring
J.T. Yeom ; J.H. Kim ; J.K. Hong ; N.K. Park ; C.S. Lee
Pub. info.: THERMEC 2009, 6th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, Berlin, Germany, August 25-29, 2009.  pp.223-228,  2010.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 638-642