1.

Conference Proceedings
Conference Proceedings
1. Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep
Cohen, S. A. ; Liu, J. ; Gignac, L. ; Ivers, T. ; Armbrust, D. ; Rodbell, K. P. ; Gates, S. M.
Pub. info.: Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.551-,  1999.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 564
2.

Conference Proceedings
Conference Proceedings
2. Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep
Armbrust, D. ; Cohen, S. A. ; Gates, S. M. ; Gignac, L. ; Ivers, T. ; Liu, J. ; Rodbell, K. P.
Pub. info.: Low-dielectric constant materials V : symposium held April 5-8, 1999, San Francisco, California, U.S.A..  pp.189-196,  1999.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 565