1.

Conference Proceedings
Conference Proceedings
1. Silicon Wafer Direct Bonding for Smart-Cut SOI with Buried Tungsten Silicide Layer
Suder, S.L. ; Hurley, R. ; Li, F.X. ; Bain, M. ; Baine, P. ; MeNeill, D.W. ; Armstrong, B.M. ; Gamble, H.S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.19-19,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
2.

Technical Paper
Technical Paper
2. Optimisation of Precious Metal Loadings in Automotive Catalysts Using Response Surface Methodology
Rutter, B. ; Hurley, R. ; Eade, D. ; Kisenyi, J. ; Collingwood, I.
Pub. info.: 1996 International Fall Fuels and Lubricants Meeting and Exposition : SAE technical paper.  pp.83-98,  1996.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 1996
3.

Technical Paper
Technical Paper
3. Replication of 50K Vehicle Aged Catalyst Performance Using an Engine Dynamometer Aging Cycle
Johnson, P. ; Kisenyi, J. ; Hurley, R.
Pub. info.: 1997 International Fall Fuels and Lubricants Meeting and Exposition : SAE technical paper.  pp.1-7,  1997.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 1997