1.

Conference Proceedings
Conference Proceedings
1. Design Considerations for SI and SIC Layer Transfer by H-Implantation
Tong, Q.-Y. ; Lee, T.-H. ; Huang, L.-J. ; Chao, Y.-L. ; Kim, W.J. ; Scholz, R. ; Tan, T.Y. ; Goesele, U.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.521-528,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. Critical Bonding Energy Required for Hydrogen-Implantation Induced Layer Splitting
Huang, L.-J. ; Tong, Q.-Y. ; Goesele, U.M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.68-79,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
3.

Conference Proceedings
Conference Proceedings
3. A MODEL FOR BLISTERING AND SPLITI'ING OF HYDROGEN IMPLANTED SILICON AND ITS APPLICATION TO SILICON-ON-QUARTZ
Huang, L.-J. ; Tong, Q.-Y. ; Lee, T.-H. ; Chao, Y.-L. ; Goesele, U.M.
Pub. info.: Silicon materials science and technology : proceedings of the Eighth International Symposium on Silicon Materials Science and Technology.  pp.1373-1384,  1998.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-1(2)
4.

Technical Paper
Technical Paper
4. CFD Design Tool Improves HVAC Design and Cuts Product Development Cycle Time.
Li, M. ; Huang, L.-J.
Pub. info.: 2008 SAE world congress : technical paper.  2008.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2008