1.

Conference Proceedings
Conference Proceedings
1. Particle-free semiconductor cutting using the water jet guided laser
Perrottet, D. ; Spiegel, A. ; Wagner, F. ; Housh, R. ; Richerzhagen, B. ; Manley, J.
Pub. info.: Photon Processing in Microelectronics and Photonics IV.  pp.240-246,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5713
2.

Conference Proceedings
Conference Proceedings
2. Scribing of GaN wafer for white LED by water-jet-guided laser
Nilsson, T. ; Wagner, F. ; Housh, R. ; Richerzhagen, B.
Pub. info.: Light-Emitting Diodes: Research, Manufacturing, and Applications VIII.  pp.200-206,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5366
3.

Conference Proceedings
Conference Proceedings
3. Heat damage-free laser-microjet cutting achieves highest die fracture strength
Perrottet, D. ; Housh, R. ; Richerzhagen, B. ; Manley, J.
Pub. info.: Photon Processing in Microelectronics and Photonics IV.  pp.285-292,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5713
4.

Technical Paper
Technical Paper
4. Water Jet Guided Laser Cutting: a Powerful Hybrid Technology for Fine Cutting and Grooving.
Richerzhagen, B. ; Housh, R. ; Wagner, F. ; Manley, J.
Pub. info.: SME technical paper.  2005.  Society of Manufacturing Engineers