1.

Conference Proceedings
Conference Proceedings
1. A new device for characterization of mechanical stress caused by packaging processes [6172-36]
Hirsch, S. ; Schmidt B
Pub. info.: Smart structures and materials 2006 : Smart electronics, MEMS, BioMEMS, and nanotechnology : 27 February-1 March 2006, San Diego, California, USA.  pp.617210-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6172
2.

Conference Proceedings
Conference Proceedings
2. Integrating Ba1-xSrxTiO3 Thin Films with Large Area, Affordable, Industry Standard Substrates for Microwave Applications
Nothwang, W. D. ; Cole, M. W. ; Joshi, P. C. ; Hirsch, S. ; Ngo, E. ; Hubbard, C. ; Demaree, J. D.
Pub. info.: Materials, integration and packaging issues for high-frequency devices.  pp.17-28,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 833
3.

Conference Proceedings
Conference Proceedings
3. Ultra-fast facial topometry using pulsed holography [6081-22]
Thelen, A. ; Frey, S. ; Hirsch, S. ; Ladriere, N. ; Hering, P.
Pub. info.: Multimodal Biomedical Imaging.  pp.60810F-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6081
4.

Conference Proceedings
Conference Proceedings
4. CMOS receiver circuits for high-speed data transmission according to LVDS-standard
Hirsch, S. ; Pfleiderer, H.-J.
Pub. info.: VLSI Circuits and Systems.  pp.238-244,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5117