1.

Conference Proceedings
Conference Proceedings
1. Comparisons of Polisher Designs on the Performance of STI Planarization
Goh, K ; Chen, F ; Balakumar, S. ; Higelin, G. ; See, A. ; Chan, L. ; Lin, C. ; Chern, C.
Pub. info.: Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium.  pp.57-70,  1999.  Pennington, N. J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-37
2.

Conference Proceedings
Conference Proceedings
2. Evaluation of 02- and N2- Addition in Via Etching and CHF3/02 Post Etch Treatment
Ho, C.N. ; Higelin, G. ; Low, C.H. ; See, A. ; Chan, L. ; Chua, D.H.C.
Pub. info.: Plasma etching processes for sub-quarter micron devices : proceedings of the international symposium.  pp.269-283,  1999.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-30
3.

Conference Proceedings
Conference Proceedings
3. Numerical Study of Current Crowding Phenomenon in Complementary 4H-SiC JBS Rectifiers
Rang, T. ; Higelin, G. ; Kurel, R.
Pub. info.: Silicon carbide and related materials 2003 : ICSCRM, 2003 : proceedings of the 10th International Conference on Silicon Carbide and Related Materials 2003, Lyon, France, October 5-10, 2003.  pp.1045-1048,  2004.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 457-460