1.

Conference Proceedings
Conference Proceedings
1. Interchip Via Technology-Three Dimensional Metallization for Vertically Integrated Circuits
Bertagnolli, E. ; Dollmann, D. ; Braun, R. ; Buchner, R. ; Engelhardt, M. ; Grassl, T. ; Hieber, K. ; Kawala, G. ; Kleiner, M. ; Klump, A. ; Kuehn, S. ; Landesberger, C. ; Pamler, W. ; Popp, R. ; Ramm, P. ; Renner, E. ; Ruhl, G. ; Saenger, A. ; Scheler, U. ; Schmidt, C. ; Schwarzl, S. ; Weber, J.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.509-520,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. DOPANT DIFFUSION FROM TON-IMPLANTED TaSI2
Gierisch, H. ; Neppl, F. ; Frenzel, E. ; Eichinger, P. ; Hieber, K.
Pub. info.: Materials issues in silicon integrated circuit processing : symposium held April 15-18, 1986, Palo Alto, California, U.S.A..  pp.183-190,  1986.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 71
3.

Conference Proceedings
Conference Proceedings
3. Interface reactions of TaSi2/Si contacts at high temperature
Oppolzer, H. ; Neppl, F. ; Hieber, K.
Pub. info.: Thin films and interfaces II : symposium held November 1983, in Boston, Massachusetts, U.S.A..  pp.593-600,  1984.  New York.  North-Holland
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 25