1.

Conference Proceedings
Conference Proceedings
1. Influence of the Height Difference between the First and Second Nitride Layer on Erosion and Dishing in the Dual Nitride Approach for Shallow Trench Isolation
Heylen, N. ; Grillaert, J. ; Vrancken, E ; Badenes, G. ; Rooyackers, R. ; Meuris, M. ; Heyns, M.
Pub. info.: Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing.  pp.26-36,  1998.  Pennington, N. J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-7
2.

Conference Proceedings
Conference Proceedings
2. A New Dummy-free Shallow Trench Isolation Concept for Mixed-Signal Applications
Badenes, G. ; Rooyackers, R. ; Augendre, E. ; Vandamme, E. ; Perello, C. ; Heylen, N. ; Grillaert, J. ; Deferm, L.
Pub. info.: ULSI process integration : proceedings of the first international symposium.  pp.231-242,  1999.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-18
3.

Conference Proceedings
Conference Proceedings
3. Characterization of Slurry System and Suppression of Oxide Erosion in Aluminum CMP (Chemical-Mechanical Planarization)
Devriendt, ft. ; Grilaert, J. ; Heylen, N. ; Holl, K. ; Meuris, M. ; Yang, J. ; Zhong, L.
Pub. info.: Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.115-122,  2000.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 566
4.

Conference Proceedings
Conference Proceedings
4. Modeling the Influence of Pad Bending on the Planarization Performance During CMP
Devriendt, K. ; Fyen, W. ; Grillaert, J. ; Heylen, N. ; Heyns, M. ; Meuris, M. ; Vrancken, E.
Pub. info.: Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.45-50,  2000.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 566