1.

Conference Proceedings
Conference Proceedings
1. The Electrical Integrity of Copper Plated Wafers Using a Novel Plating Bath Chemistry : Feasibility of RTA for Film Stabilization
Simpson, C.R. ; Baker, B.C. ; Herrick, M. ; Basser, P. ; Hamilton, G. ; Weitzman, E. ; Hey, P. ; Subramanyan, S. ; Chen, M. ; Shin, H. Seon ; Dordi, Y. ; Cheung, R. ; Carl, D.
Pub. info.: Interconnect and contact metallization for ULSI : proceedings of the international symposium.  pp.130-138,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-31
2.

Conference Proceedings
Conference Proceedings
2. Characterization of a Single Wafer Multi-Chamber Clustered EPI System at Reduced Pressure
Borland, J. ; Carlson, D. ; Riggi, C. ; Florendo, L. ; Pohl, C. ; Gong, B. ; Hey, P.
Pub. info.: Proceedings of the Twelfth International Symposium on Chemical Vapor Deposition.  pp.147-155,  1993.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1993-2
3.

Conference Proceedings
Conference Proceedings
3. Room Temperature Self-Annealing of Electroplated and Sputtered Copper Films
Chen, M. ; Rengarajan, S. ; Hey, P. ; Dordi, Y. ; Zhang, H. ; Hashim, I. ; Ding, P. ; Chin, B.
Pub. info.: Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.413-,  1999.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 564
4.

Conference Proceedings
Conference Proceedings
4. Room Temperature Self-Annealing of Electroplated and Sputtered Copper Films
Chen, M. ; Chin, B. ; Ding, P. ; Dordi, Y. ; Hashim, I. ; Hey, P. ; Rengarajan, S. ; Zhang, H.
Pub. info.: Polycrystalline metal and magnetic thin films : symposium held April 5-8, 1999, San Francisco, California, U.S.A..  pp.249-256,  1999.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 562