1.

Conference Proceedings
Conference Proceedings
1. Experimental Study on Bond-Slip Constitutive Relation between CFL and Concrete
Zheng, X.H. ; Huang, P.Y. ; Guo, X.Y. ; Han, Q.
Pub. info.: Advanced engineering and materials : selected, peer reviewed papers from the 2013 International Conference on Mechanical Engineering and Materials (ICMEM 2013), Sanya, China, 27-28 January 2013.  pp.359-364,  2013.  Stafa-Zuerich.  Trans Tech Publications
Title of ser.: Applied mechanics and materials
Ser. no.: 302
2.

Conference Proceedings
Conference Proceedings
2. H2/He Plasma for Photoresist Stripping over Porous MSQ Low-k Films
Berry, I. ; Shiota, A. ; Han, Q. ; Waldfried, C. ; Sekiguchi, M. ; Escorcia, O.
Pub. info.: Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium.  pp.202-210,  2002.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-22
3.

Conference Proceedings
Conference Proceedings
3. Material composition and structure design in PCVD silico-based single-mode fiber [6352-118]
Han, Q. ; Zhao, X. ; Tu, F. ; Luo, J.
Pub. info.: Optoelectronic materials and devices : 5-7 September, 2006, Gwangju, South Korea.  pp.635236-635236,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6352
4.

Conference Proceedings
Conference Proceedings
4. Single- photon acquisition probability for free-space quantum key distribution
Zhang, G. ; Ma, J. ; Tan, L. ; Yu, S. ; Han, Q. ; Chen, Y.
Pub. info.: Quantum optics and applications in computing and communications II : 10-12 November 2004, Beijing, China.  pp.173-180,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5631
5.

Conference Proceedings
Conference Proceedings
5. Comparison of different configurations of distributed Raman amplifiers with dispersion compensation module
Chi, R.H. ; Lu, K.C. ; Han, Q. ; Li, Y.G.
Pub. info.: Materials and devices for optical and wireless communications : APOC 2002 : Asia-Pacific Optical and Wireless Communications : 15-18 October, 2002, Shanghai, China.  pp.583-587,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4905
6.

Conference Proceedings
Conference Proceedings
6. Downstream Microwave Plasma BCB-Descum Process Using Oxygen-Free Chemistry for Wafer-Level Chip Packaging Applications;
Han, Q.
Pub. info.: Proceedings from the tenth Meeting of the Symposium on Polymers for Microelectronics [May 8th, 9th, & 10th, 2002].  pp.343-362,  2002.  [S.l.].  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-16
7.

Conference Proceedings
Conference Proceedings
7. Structural Analyses Of Fluorine-Doped Silicon Dioxide Dielectric Thin Films By Micro-Raman Spectroscopy
Liou, H. ; Duel, J. ; Finch, V. ; Han, Q. ; Sakthivel, P. ; Ruffin, R.
Pub. info.: Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A..  pp.D5.10-,  2001.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 612
8.

Conference Proceedings
Conference Proceedings
8. Plasma and UV Assisted RapidcuringTM of Low-K Materials
Waldfried, C. ; Margolis, A. ; Escorcia, O. ; Han, Q. ; Albano, R. ; Berry, I.
Pub. info.: Rapid thermal and other short-time processing technologies III : proceedings of the international symposium.  pp.53-62,  2002.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-11
9.

Conference Proceedings
Conference Proceedings
9. Reducing Plasma Chemistry for Photoresist and Residue Removal over Low-k Materials
Wladfried, C. ; Han, Q. ; Kuo, J.
Pub. info.: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium.  pp.207-212,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-27
10.

Conference Proceedings
Conference Proceedings
10. H2O Vapor Assisted Plasma Chemistry for Photoresist and Polymer Removal over Low-k Materials
RufJin, R. ; Waldfried, C. ; Han, Q. ; Berry, I.
Pub. info.: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium.  pp.201-206,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-27