1.

Conference Proceedings
Conference Proceedings
1. New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers
B. Aspar ; C. Lagahe-Blanchard ; N. Sousbie ; J. Margail ; H. Moriceau
Pub. info.: Semiconductor wafer bonding 9 : science, technology, and applications.  pp.79-90,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(6)
2.

Conference Proceedings
Conference Proceedings
2. Effect of Prebonding Surface Treatments on Si-Si Direct Bonding : Bonding Void Decrease
R. Beneyton ; F. Fournel ; F. Rieutord ; C. Morales ; H. Moriceau
Pub. info.: Semiconductor wafer bonding 9 : science, technology, and applications.  pp.239-248,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(6)
3.

Conference Proceedings
Conference Proceedings
3. Low Temperature Void Free Hydrophilic or Hydrophobic Silicon Direct Bonding
F. Fournel ; H. Moriceau ; R. Beneyton
Pub. info.: Semiconductor wafer bonding 9 : science, technology, and applications.  pp.139-146,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(6)
4.

Conference Proceedings
Conference Proceedings
4. Rough Surface Adhesion Mechanisms for Wafer Bonding
F. Rieutord ; H. Moriceau ; R. Beneyton ; L. Capello ; C. Morales
Pub. info.: Semiconductor wafer bonding 9 : science, technology, and applications.  pp.205-215,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(6)
5.

Conference Proceedings
Conference Proceedings
5. Low Temperature Wafer Bonding
F. Fournel ; H. Moriceau ; C. Ventosa ; L. Libralesso ; Y. Le Tiec
Pub. info.: Semiconductor Wafer Bonding 10: Science, Technology, and Applications.  pp.475-488,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(8)