1.

Conference Proceedings

Conference Proceedings
D. Gu ; K. Tapily ; P. Shrestha ; G. Celler ; H. Baumgart
Pub. info.: Physics and technology of high-k gate dielectrics 5.  pp.421-429,  2007.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 11(4)
2.

Conference Proceedings

Conference Proceedings
M. Thitsa ; D. Gu ; H. Baumgart ; S. Albin
Pub. info.: Atomic layer deposition applications 3.  pp.259-267,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 11(7)
3.

Conference Proceedings

Conference Proceedings
P.R. Shrestha ; D. Gu ; K. Tapily ; H. Baumgart
Pub. info.: Atomic layer deposition applications 4.  pp.51-58,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(4)
4.

Conference Proceedings

Conference Proceedings
T.M. Abdel-Fattah ; D. Gu ; H. Baumgart ; G. Namkoong
Pub. info.: Atomic layer deposition applications 4.  pp.159-164,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(4)
5.

Conference Proceedings

Conference Proceedings
K. Tapily ; J. Jakes ; P.R. Shrestha ; D. Gu ; H. Baumgart
Pub. info.: Atomic layer deposition applications 4.  pp.269-277,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(4)
6.

Conference Proceedings

Conference Proceedings
D. Gu ; H. Baumgart ; K. Bourdelle ; G.K. Celler ; A. Elmustafa
Pub. info.: Semiconductor Wafer Bonding 10: Science, Technology, and Applications.  pp.385-391,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(8)
7.

Conference Proceedings

Conference Proceedings
K. Tapily ; H. Baumgart ; D. Gu ; A. Elmustafa ; M. Krause
Pub. info.: Semiconductor Wafer Bonding 10: Science, Technology, and Applications.  pp.337-345,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(8)
8.

Conference Proceedings

Conference Proceedings
D. Gu ; H. Baumgart ; M. Zhu ; G.K. Celler
Pub. info.: Semiconductor Wafer Bonding 10: Science, Technology, and Applications.  pp.329-335,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(8)