1.

Conference Proceedings
Conference Proceedings
1. Manufacture Processes for WSi2 GPSOI Substrates and Their Influence on Cross-Talk Suppression and Inductance
Baine, P. ; Gamble, H. ; Armstrong, B.M ; Bain, M. ; McNeill, D.W. ; Hamel, J. ; Stefanos, S. ; Kraft, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.57-63,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. Chemical Vapour Deposition of Cobalt for Magnetic Applications
Deo, N. ; Montgomery, J. ; Bain, M. ; Gamble, H.
Pub. info.: Chemical vapor deposition XVI and EUROCVD 14 : proceedings of the international symposium.  pp.1008-1015,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-8
3.

Conference Proceedings
Conference Proceedings
3. Variants on Bonded SOI for Advanced ICs
Gamble, H.
Pub. info.: Silicon-on-Insulator Technology and Devices X : proceedings of the tenth International Symposium.  pp.1-12,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-3
4.

Conference Proceedings
Conference Proceedings
4. A Commodity Analogue Process Based on Bonded Wafers
McStay, K. ; Smoot, F. ; Hariton, D. ; Egan, K. ; Irvme, D. ; Brown, G. ; Edwards, P. ; Blackstone, S. ; Gamble, H.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.466-470,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7
5.

Conference Proceedings
Conference Proceedings
5. A Comparison of Bipolar Devises in Bonded and Trenches Wafers with junction and Trench Isolated Bulk Wafers
DeCoursey, M. ; Alderman, J.C. ; Blackstone, S. ; Gamble, H.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.420-425,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7