1.

Conference Proceedings
Conference Proceedings
1. Weakening of Hardness and Modulus of the Si Lattice by Hydrogen Implantation for Layer Transfer in Wafer Bonding Technology
D. Gu ; H. Baumgart ; K. Bourdelle ; G.K. Celler ; A. Elmustafa
Pub. info.: Semiconductor Wafer Bonding 10: Science, Technology, and Applications.  pp.385-391,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(8)
2.

Conference Proceedings
Conference Proceedings
2. Strain Relaxation in Patterned Strained Silicon-on-Insulator by Raman Spectroscopy
D. Gu ; H. Baumgart ; M. Zhu ; G.K. Celler
Pub. info.: Semiconductor Wafer Bonding 10: Science, Technology, and Applications.  pp.329-335,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(8)