1.

Conference Proceedings
Conference Proceedings
1. Introducing Advanced ULK Dielectric Mateials in Interconnects: Performance and Integration Challenges
Fusalba, F. ; Cornec, C.Le ; Maury, P. ; Remiat, B. ; Jousseaume, V. ; Haxaire, K. ; Mourier, T. ; Haumesser, P.H ; Maitrejean, S. ; Simon, J. ; Chabli, A. ; Passemard, G. ; Fusalba, F. ; Cornec, C.Le ; Maury, P. ; Remiat, B. ; Jousseaume, V.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.186-205,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings
Conference Proceedings
2. Copper-Barrier and Hard-Mask Elaboration by Plasma-Enhanced Chemical Vapor Deposition Using Organosilane Precursors
Remiat, B. ; Fusalba, F. ; Maury, P. ; Jousseaume, V. ; Lecornec, C. ; Gaillard, F. ; Durand, J.
Pub. info.: Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium.  pp.120-125,  2002.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2002-22
3.

Conference Proceedings
Conference Proceedings
3. Copper-Barrier and Hard-Mask Elaboration by Plasma-Enhanced Chemical Vapor Deposition Using Organosilane Precursors
Remiat, B ; Fusalba, F. ; Maury, P. ; Jousseaume, V ; Lecornec, C. ; Gaillard, F. ; Durand, I.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.14-19,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
4.

Conference Proceedings
Conference Proceedings
4. Plasma Treatments and PECVD Dielectric Deposition Impact on Porous SiOC
Jousseaume, V. ; Maury, P. ; Le Cornec, C. ; Zenasni, A. ; Remiat, B ; Fusalba, F. ; Passemard, G.
Pub. info.: Silicon nitride, silicon dioxide thin insulating films, and other emerging dieletrics VIII : proceedings of the international symposium.  pp.97-112,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-01