1.

Conference Proceedings
Conference Proceedings
1. Reference-free detection of semiconductor assembly defect
Ng, A. N. Y. ; Lam, E. Y. ; Chung, R. ; Fung, K. S. M. ; Leung, W. H.
Pub. info.: Machine Vision Applications in Industrial Inspection XIII.  pp.27-35,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5679
2.

Conference Proceedings
Conference Proceedings
2. Three-dimensional reconstruction of wafer solder bumps using binary pattern projection
Cheng, J. ; Chung, R. ; Lam, E. Y. ; Fung, K. S. M. ; Wang, F. ; Leung, W. H.
Pub. info.: Machine Vision Applications in Industrial Inspection XIII.  pp.44-52,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5679