1.

Conference Proceedings
Conference Proceedings
1. Post-processing gap reduction in a micromachined resonator for vacuum pressure measurement
Billep, D. ; Hiller, K. ; Fromel, J. ; Tenholte, D. ; Reuter, D. ; Dofzel, W. ; GeBner, T.
Pub. info.: Smart sensors, actuators, and MEMS II : 9-11 May 2005, Seville, Spain.  pp.341-350,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5836
2.

Conference Proceedings
Conference Proceedings
2. Bonding and Contacting of MEMS-Structures on Wafer Level
Wiemer, M. ; Fromel, J. ; Jia, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.301-308,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
3.

Conference Proceedings
Conference Proceedings
3. Silicon Wafer Bonding for Encapsulating Surface-Micromechanical-Systems using Intermediate Glass Layers
Knechtel, R. ; Heller, J. ; Wiemer, M. ; Fromel, J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.321-328,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19