1.

Technical Paper
Technical Paper
1. An Experimental Investigation of Material Removal Rate in Polishing of Silicon Wavers.
Zhang, X.H. ; Pei, Z.J. ; Esayanur, M. ; Bowers, G.L. ; Fisher, G.R.
Pub. info.: S.M.E. technical paper.  2007.  Dearborn, Mich..  Society of Manufacturing Engineers
Title of ser.: SME Technical Paper : TP
Ser. no.: 2007
2.

Technical Paper
Technical Paper
2. Surface Grinding in Silicon Wafer manufacturing in Silicon Wafer Manufacturing.
Pei, Z. ; Fisher, G.R.
Pub. info.: SME technical paper.  2001.  Society of Manufacturing Engineers
3.

Technical Paper
Technical Paper
3. Fine Grinding of Silicon Wafer: Benefits and Technical Barriers.
Peii, Z.J. ; Fisher, G.R. ; Strasbaugh, A.
Pub. info.: SME technical paper.  2004.  Society of Manufacturing Engineers
4.

Technical Paper
Technical Paper
4. Optimization of Process Parameters in Manufacturing: An Approach of Multiple Attribute Decision Making.
Sun, W.P. ; Pei, Z.J. ; Lee, E.S. ; Fisher, G.R.
Pub. info.: SME technical paper.  2005.  Society of Manufacturing Engineers