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Conference Proceedings

1. IN-SITU ANALYSIS OF THE MICROSTRUCTURE OF THERMALLY TREATED THIN COPPER FILMS

Nucci, J. ; Neves, H. ; Shacham, Y. ; Eisenbraun, E. ; Zheng, B. ; Kaloyeros, A.

Pub. info.:	Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A.. pp.377-, 1993. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	309

Conference Proceedings

2. Wafer-Level 3D System-on-a-Chip using Dielectric Glue Wafer Bonding and Cu Damascene Inter-Wafer Interconnects

Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K.-W. ; Kraft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraun, E. ; Cale, T.S. ; Gutmann, R.J

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.87-95, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

3. Chemical Vapor Deposition of Novel Precursors for Advanced Capacitor Electrodes

Peck, J. ; Hoover, C.A. ; Atwood, J.D. ; Hoth, D.C. ; Cansiglio, S. ; Papadatos, F. ; Eisenbraun, E.

Pub. info.:	Rapid thermal and other short-time processing technologies III : proceedings of the international symposium. pp.235-244, 2002. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2002-11

Conference Proceedings

4. ULTRA THIN SACRIFICIAL DIFFUSION BARRIERS-CONTROL OF DIFFUSION ACROSS THE Cu-SiO2 INTERFACE

Kirchner, Eric ; Murarka, S. P. ; Eisenbraun, E. ; Kaloyeros, A.

Pub. info.:	Interface control of electrical, chemical, and mechanical properties : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A.. pp.319-, 1994. Pittsburgh. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	318