1.

Conference Proceedings
Conference Proceedings
1. Non-Destructive Lifetime Prediction in Material Testing with the Bonn Positron Microprobe
Mueller, I. ; Bennewitz, K. ; Haaks, M. ; Staab, T.E.M. ; Eisenberg, S. ; Lampe, T. ; Maier, K.
Pub. info.: Positron annihilation ICPA-13 : proceedings of the 13th International Conference on Positron Annihilation, Kyoto, Japan, September 2003.  pp.498-500,  2004.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 445-446
2.

Technical Paper
Technical Paper
2. Reliability Testing and Damage Analysis of Lead-Free Solder Joints: New Assessment Criteria for Laboratory Methods.
Steller, A. ; Zimmermann, A. ; Eisenberg, S. ; Wolter, K-J. ; Lange, P.
Pub. info.: 2009 SAE world congress : technical paper.  2009.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2009
3.

Conference Proceedings
Conference Proceedings
3. Visualization and PIV measurements of high-speed flows and other phenomena with novel ultrahigh-speed CCD camera
Eisenberg, S. ; Reckers, W. ; Wieneke, B.
Pub. info.: 25th International Congress on High-Speed Photography and Photonics.  pp.671-676,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4948