1.

Conference Proceedings
Conference Proceedings
1. Copper-Barrier and Hard-Mask Elaboration by Plasma-Enhanced Chemical Vapor Deposition Using Organosilane Precursors
Remiat, B ; Fusalba, F. ; Maury, P. ; Jousseaume, V ; Lecornec, C. ; Gaillard, F. ; Durand, I.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.14-19,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings
Conference Proceedings
2. On Motion of Adhering Vesicles
Durand, I. ; Misbah, C.
Pub. info.: Materials science of the cell : symposium held December 1-4, 1997, Boston, Massachusetts, U.S.A..  pp.199-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 489
3.

Technical Paper
Technical Paper
3. Oxygenated Compounds and Diesel Engine Pollutant Emissions Performances of New Generation of Products.
Delfort, B. ; Durand, I. ; Jaecker-Voirol, A. ; Lacome, T. ; Paille, F.
Pub. info.: 2002 Powertrain and Fluid Systems Conference and Exhibition : SAE technical paper.  2002.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2002
4.

Technical Paper
Technical Paper
4. Glycerol Derivatives for Diesel Fuel Reformulation.
Jaecker-Voirol, A. ; Delfort, B. ; Montagne, X. ; Durand, I. ; Hillion, G.
Pub. info.: 2005 Brasil Fuels & Lubricants Meeting and Exhibition : SAE technical paper.  2005.  Warrendale, Penn..  Society of Automotive Engineers
Title of ser.: Society of Automotive Engineers technical paper series
Ser. no.: 2005