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Conference Proceedings

1. Low Temperature Si-Si and GaAs-Si Direct Wafer Bonding using Spin-On Glass Intermediate Layer

Dragoi, V. ; Alexe, M. ; Reiche, M.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.80-84, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-35

Conference Proceedings

2. Plasma Activation for Low-Temperature Wafer Direct Bonding

Reiche, M. ; Wiegand, M. ; Dragoi, V.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.292-301, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-35

Conference Proceedings

3. Plasma activated water bonding for MEMS

Dragoi, V. ; Farrens, S. ; Lindner, P.

Pub. info.:	Smart sensors, actuators, and MEMS II : 9-11 May 2005, Seville, Spain. pp.179-187, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5836

Conference Proceedings

4. Advanced Anodic Bonding Processes for MEMS Applications

Dragoi, V. ; Lindner, P. ; Glinsner, T. ; Wimplinger, M. ; Farrens, S.

Pub. info.:	Micro- and nanosystems : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A.. pp.337-342, 2004. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	782

Conference Proceedings

5. Plasma Activated Wafer Bonding for Thin Silicon-On-Insulator Substrate Fabrication

Linder, P. ; Farrens, S. ; Dragoi, V.

Pub. info.:	Dielectrics for nanosystems: materials science, processing, reliability, and manufacturing : proceedings of the First international symposium. pp.97-102, 2004. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2004-04

Conference Proceedings

6. Plasma Bonding Replacement Methods for Traditional Bond Technologies

Farrens, S. ; Dragoi, V. ; Pelzer, R. ; Wimplinger, M. ; Lindner, P.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.58-63, 2005. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2005-02

Conference Proceedings

7. Triple-Stack Anodic Bonding for MEMS Applications

Dragoi, V. ; Glinsner, T. ; Hangweier, P. ; Lindner, P.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.329-336, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

8. Wafer Bonding for Optical Microsystems -

Hiller, E. ; Stolze, D. ; Wiegand, M. ; Dragoi, V. ; Reiche, M.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.254-264, 2001. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2001-27

Conference Proceedings

9. Adhesive wafer bonding for MEMS applications

Dragoi, V. ; Glinsner, T. ; Mittendorfer, G. ; Wieder, B. ; Lindner, P.

Pub. info.:	Smart Sensors, Actuators, and MEMS. 1 pp.160-167, 2003. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5116

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Technical Paper

10. Aligned Wafer bonding for MEMS Devices.

Weixlberger, J. ; Dragoi, V. ; Lindner, P.

Pub. info.:

SME technical paper. 2004. Society of Manufacturing Engineers

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Author: Dragoi, V.