1.

Conference Proceedings
Conference Proceedings
1. Laser cleaning of silicon wafers: mechanisms and efficiencies
Mosbacher,M. ; Bertsch,M. ; Munzer,H.-J. ; Dobler,V. ; Runge,B.-U. ; Bauerle,D. ; Boneberg,J. ; Leiderer,P.
Pub. info.: Second International Symposium on Laser Precision Microfabrication : 16-18 May 2001, Singapore.  pp.308-314,  2001.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4426
2.

Conference Proceedings
Conference Proceedings
2. Laser-induced particle removal from silicon wafers
Leiderer,P. ; Boneberg,J. ; Dobler,V. ; Mosbacher,M. ; Munzer,H.-J. ; Chaoui,N. ; Siegel,J. ; Solis,J. ; Afnso,C.N. ; Fourrier,T. ; Schrems,G. ; Bauerle,D.
Pub. info.: High-power laser ablation III, 24-28 April 2000, Santa Fe, USA.  pp.249-259,  2000.  Bellingham, Wash., USA.  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4065