1.

Conference Proceedings
Conference Proceedings
1. Model of Wafer Thickness Uniformity in an Electroplating Tool
Deligianni, H. ; Dukovic, J.O. ; Walton, E.G. ; Contolini, R.J. ; Reid, J. ; Patton, E.
Pub. info.: Electrochemical processing in ULSI fabrication and semiconductor/metal deposition II : proceedings of the international symposium.  pp.83-95,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-9
2.

Conference Proceedings
Conference Proceedings
2. A Model of Superfihling in Damascene Electroplating
Deligianni, H. ; Dukovic, J.O. ; Andricacos, P.C. ; Walton, E.G.
Pub. info.: Electrochemical processing in ULSI fabrication and semiconductor/metal deposition II : proceedings of the international symposium.  pp.52-60,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-9
3.

Conference Proceedings
Conference Proceedings
3. Computational Aspects of the Terminal Effect on Wafer-Scale Uniformity
Deligianni, H. ; Dukovic, J. ; Mebdizadeb, S.
Pub. info.: Tutorials in electrochemical engineering - mathematical modeling : proceedings of the International Symposium.  pp.124-140,  1999.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-14
4.

Conference Proceedings
Conference Proceedings
4. Model of Superfilling in Damascene Electroplating: Comparison of Experimental Feature Filling with Model Predictions
Deligianni, H. ; Horkans, J. ; Kwietniak, K. ; Dukovic, J.O. ; Andricacos, P.C. ; Boettcher, S. ; Seo, S.-C. ; Locke, P. ; Simon, A. ; Seymour, S. ; Malhotra, S.
Pub. info.: Electrochemical processing in ULSI fabrication III : proceedings of the international symposium.  pp.145-160,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-8
5.

Conference Proceedings
Conference Proceedings
5. Damascene Electroplating for Copper Interconnections
Andriacacos, P.C. ; Uzoh, C. ; Dukovic, J.O. ; Horkans, J. ; Deligianni, H.
Pub. info.: Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization: materials, processes, and reliability.  pp.48-58,  1998.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-6
6.

Conference Proceedings
Conference Proceedings
6. MEMS Fabrication for Wireless Communications Using Copper Interconnect Technology
Deligianni, H. ; Cotte, J.M. ; Jahnes, C.V. ; Buchwalter, P. ; Hoivik, N. ; Krishnan, M ; Tornello, J. ; Magerlein, J.H. ; Seeger, D.E.
Pub. info.: Electrochemical processes in ULSI and MEMS : proceedings of the international symposium.  pp.341-352,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-17
7.

Conference Proceedings
Conference Proceedings
7. Uniform Copper Electroplating on Resistive Substrates
Fang, R. ; Namiki, K. ; Vereecken, P.M. ; Kwietniak, K.T. ; Baker, B.C. ; Ide, K. ; Suzuki, H. ; Kanda, H. ; Mishima, K. ; Musaka, K. ; Deligianni, H.
Pub. info.: Electrochemical processes in ULSI and MEMS : proceedings of the international symposium.  pp.193-204,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-17
8.

Conference Proceedings
Conference Proceedings
8. 3. Electrochemical fabrication of PbSn C4 Interconnections
Datta, M. ; Shenoy, R.V. ; Jahnes, C. ; Andricacos, P.C. ; Horkans, J. ; Dukovic, J.O. ; Romankiw, L.T. ; Roeder, J. ; Deligianni, H. ; Nye, H. ; Agarwala, B. ; Tong, H.M. ; Totta, P.
Pub. info.: Proceedings of the Second International Symposium on Electrochemical Microfabrication.  pp.35-44,  1994.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1994-32